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Ceramic SOIC


Unit: Inches

The SOIC is ideal for applications that require dense placement of chips on boards.

  • Multilayer Ceramic Package
  • Surface Mount with .050” lead spacing
  • Comparable Foot Print as Plastic SOP
  • Solder, Glass or Epoxy Seal
  • Gull Wing Lead Configuration
  • Gold Plated Leads

Please click here to start the RFQ process, then select the products that you are interested in.

LEAD COUNT MFR DRAWING NO CAVITY SIZE CERAMIC OD BOND FINGER LAYOUT RFQ QTY
16 Kyocera PB-F88151 .283 x .170 .411 x .293 2 x 6
20 Kyocera PB-F86652-C .161 x .283 .504 x .293 4 x 6
20 Kyocera PB-F86652 .283 x .170 .504 x .293 4 x 6
24 Kyocera PB-F86653 .283 x .170 .606 x .293 6 x 6
28 Kyocera PB-F88154 .283 x .170 .706 x .293 6 x 8

Not finding what you want? Please contact us as our published and non-published list of materials is dynamic and changes daily.