J-Bend Leaded Chip Carrier
The J-Bend Leaded Chip Carrier (CQFJ) is an ideal package in high heat dissipation applications. The leads allow the package to expand and contract during heating and cooling cycles without placing undue stress on the package to PCB connection.
- Multilayer Ceramic Package
- Excellent electrical performance and thermal management
- Footprint Compatible with LCC and PLCC
- Surface Mount or Socket Applications
- Gold Plated Leads
- Solder, Glass or Epoxy Seal