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J-Bend Leaded Chip Carrier

J-Bend Leaded Chip Carrier
Unit: Inches

The J-Bend Leaded Chip Carrier (CQFJ) is an ideal package in high heat dissipation applications. The leads allow the package to expand and contract during heating and cooling cycles without placing undue stress on the package to PCB connection.

  • Multilayer Ceramic Package
  • Excellent electrical performance and thermal management
  • Footprint Compatible with LCC and PLCC
  • Surface Mount or Socket Applications
  • Gold Plated Leads
  • Solder, Glass or Epoxy Seal

Please click here to start the RFQ process, then select the products that you are interested in.

LEAD COUNT MFR DRAWING NO CAVITY SIZE SEAL RING OD SEAL RING ID CERAMIC OD RFQ QTY
28 Kyocera PB-F87048 .240 x .240 .370 x .370 .300 x .300 .450 x .450
28 Kyocera PB-F88428 .290 x .290 .410 x .410 .346 x .346 .450 x .450
44 Kyocera PB-F86079 .250 x .250 .500 x .500 .390 x .390 .650 x .650
44 Kyocera PB-A93237 .300 x .300 .500 x .500 .390 x .390 .650 x .650
44 Kyocera PB-F86315 .340 x .340 .505 x .505 .420 x .420 .650 x .650
44 Kyocera PB-A95055 .400 x .400 .530 x .530 .450 x .450 .650 x .650
44 Kyocera PB-F87049 .440 x .440 .570 x .570 .500 x .500 .650 x .650
52 Kyocera PB-F90273 .300 x .300 .574 x .574 .440 x .440 .750 x .750
52 Kyocera PB-A95321 .350 x .350 .574 x .574 .440 x .440 .750 x .750
52 Kyocera PB-F86237 .350 x .350 .574 x .574 .440 x .440 .750 x .750
68 Kyocera PB-F91550-B .300 x .300 .624 x .624 .480 x .480 .950 x .950
68 Kyocera PB-F86320-A .300 x .300 .624 x .624 .480 x .480 .950 x .950
68 Kyocera PB-F86764 .400 x .400 .624 x .624 .490 x .490 .950 x .950
68 Kyocera PB-A95315 .600 x .600 .760 x .760 .680 x .680 .950 x .950
84 Kyocera PB-F92942 .300 x .300 .734 x .734 .560 x .560 1.15 x 1.15
84 Kyocera PB-F88587 .350 x .450 .734 x .734 .560 x .560 1.15 x 1.15
84 Kyocera PB-F86474 .400 x .400 .734 x .734 .574 x .574 1.15 x 1.15
84 Kyocera PB-F86521-A .460 x .460 .734 x .734 .560 x .560 1.15 x 1.15
84 Kyocera PB-F86475 .500 x .500 .774 x .774 .614 x .614 1.15 x 1.15

Not finding what you want? Please contact us as our published and non-published list of materials is dynamic and changes daily.