Ceramic Pin Grid Array

The Ceramic Pin Grid Array, or PGA, is a square or rectangular through-hole ceramic package with pins arranged in a square array at the bottom of the package body. The PGA can either have a frit-sealed ceramic lid or a solder-sealed metal lid. PGA’s are a popular choice for devices due to high I/O signal carrying capacity, excellent electrical performance and high thermal heat dissipation all with minimal package size. Typical PGA’s have pin counts ranging from 28-476 and pins are usually spaced 100 mils (approximately 2.54 mm) apart.

Advantages of Pin Grid Arrays

  • Multilayer Ceramic Package
  • Footprint Compatible with PPGA
  • Through Hole or Socket Mount
  • Variety of Body Sizes
  • Gold Plated Pins brazed in a matrix pattern
  • Solder, Glass or Epoxy Seal
  • Cavity Up or Cavity Down Configuration

Unit: Inches