SOIC – Small Outline Integrated Circuit

The Small Outline Integrated Circuit, or SOIC, is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. The leads protrude from the longer edge of the package. It is one of the most commonly used surface mount packages. SOIC packages are JEDEC-compliant, and come in a variety of body widths. The most common are either the narrow body of 150 mils or 3.8 mm, or the wide body of 300 mils or 7.5 mm. The standard SOIC lead pitch is nominally 50 mils (1.27 mm). The SOIC is ideal for all applications that require dense placement of chips on boards.

Advantages of SOIC

• Multilayer Ceramic Package
• Surface Mount with .050″ lead spacing
• Comparable Foot Print as Plastic SOP
• Solder, Glass or Epoxy Seal
• Gull Wing Lead Configuration
• Gold Plated Leads

Unit: Inches