Leaded Chip Carrier- J Bend (LDCC-J or CQFJ)

The J Bend Leaded Chip Carrier or LDCC-J / CQFJ is a square or rectangular surface-mount ceramic package that has J-formed leads around its periphery. The plastic-molded equivalent of the CQFJ is the PLCC. Typical LDCC-J’s have lead counts that range from 20 to 84. A LDCC-J lead pitch (distance between leads) is typically 50 mils (1.27 mm). The package can either be directly soldered onto the PCB or using a socket.

The J-Bend Leaded Chip Carrier (CQFJ) is an ideal package in high heat dissipation applications. The leads allow the package to expand and contract during heating and cooling cycles without placing undue stress on the package to PCB connection.

Advantages of LDCC-J / CQFJ

• Multilayer Ceramic Package
• Excellent Electrical Performance and Thermal Management
• Footprint Compatible with LCC and PLCC
• Surface Mount or Socket Applications
• Gold Plated Leads
• Solder, Glass or Epoxy Seal

Unit: Inches