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Ceramic LidCeramic Pin Grid ArrayCeramic SOICCeramic Substrate
CerquadCombo lid – RectangleCombo lid – SquareESD Packaging
IC SocketLeaded Chip Carrier/FlatpackLeaded Chip Carrier J-BendLeadless Chip Carrier
Open Cavity Plastic PackagesPower Transistor Outline (TO)Sidebraze (DIP)Silicon WaferTransistor Outline (TO Header)
36
.310 x .450
N/A
LDCC
