Phone: (408) 238-0200
ESM Quality CommitmentConflict Minerals PolicyESM Terms and Conditions of Sale
Ceramic LidCeramic Pin Grid ArrayCeramic SOICCeramic Substrate
CerquadCombo lid – RectangleCombo lid – SquareESD Packaging
IC SocketLeaded Chip Carrier/FlatpackLeaded Chip Carrier J-BendLeadless Chip Carrier
Open Cavity Plastic PackagesPower Transistor Outline (TO)Sidebraze (DIP)Silicon WaferTransistor Outline (TO Header)
.355 x .355
.290 x .290
