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Ceramic LidCeramic Pin Grid ArrayCeramic SOICCeramic Substrate
CerquadCombo lid – RectangleCombo lid – SquareESD Packaging
IC SocketLeaded Chip Carrier/FlatpackLeaded Chip Carrier J-BendLeadless Chip Carrier
Open Cavity Plastic PackagesPower Transistor Outline (TO)Sidebraze (DIP)Silicon WaferTransistor Outline (TO Header)
1.024 x 1.024
.900 x .900
0.025
flat
