Search for:

Home
Products
Company
Quality
Inquiry
0 items

Phone: (408) 425-9921

ESM Quality Commitment
Conflict Minerals Policy
ESM Terms and Conditions of Sale

REACH Statement
RoHS Statement
Standard Purchase Order Requirements and Clauses

Ceramic Lid
Ceramic Pin Grid Array
Ceramic SOIC
Ceramic Substrate

Cerquad
Combo lid – Rectangle
Combo lid – Square
ESD Packaging

IC Socket
Leaded Chip Carrier/Flatpack
Leaded Chip Carrier J-Bend
Leadless Chip Carrier

Open Cavity Plastic Packages
Power Transistor Outline (TO)
Sidebraze (DIP)
Silicon Wafer
Transistor Outline (TO Header)

Home / SOIC (Small Outline Integrated Circuit) / PB-F86653

Awaiting Drawing Number image

PB-F86653

PB-F86653 quantity

Category: SOIC (Small Outline Integrated Circuit)

Additional information

Additional information

Lead Count	24
Cavity Size	.170 x .283
Ceramic OD	.293 x .606
Part Type	SOIC
Bond Finger Layout	6 x 6

Related Drawing Numbers

PB-F86652-C
PB-F86652-B
PB-F88154

Not finding what you want? Please contact us as our published list of inventory is dynamic and changes daily.

ISO 9001:2008 / AS9120:2009 Certified
Woman Owned and Founded Small Business

San Jose, CA
Phone: (408) 425-9921
Email: meri@evergreensemiconductor.com

©2025 Evergreen Semiconductor Materials, Inc. All Rights Reserved. | Privacy Policy